MP81锡膏介绍 January 5, 2016 Title and author of presentation 4
1.金属合金：Sn63Pb38.8Ag0.2
2.助焊剂活性ROL1
3.润湿性强，适用于可焊性较差的基材或原件端子
4.低助焊剂残留，免清洗
5.抗立碑
TYPICAL PROPERTIES
Based on type 3 powder. Solder Paste Typical Properties
|
Alloy |
63S2 |
Sn63 |
|
Metal Content, % |
90±0.5 |
90±0.5 |
|
Viscosity @ 25 °C(1) |
150~210Pa.s |
150~210Pa.s |
|
Malcolm Thixotropic Index (TI) (2) |
0.45~0.55 |
0.45~0.55 |
|
Metal Point |
183℃ |
183℃ |
|
Alloy Component |
Sn63Pb36.8Ag0.2 |
Sn63Pb37 |
|
Powder Particle Size |
T3(25~45μm) T4(20~38μm) |
T3(25~45μm) T4(20~38μm) |
|
IPC Slump A21 mm(3) 25°C, 15 minutes 0.33 x 2.03mm pads 0.63 x 2.03mm pads |
IPC A21 Pattern 0.10 0.33 |
IPC A21 Pattern 0.10 0.33 |
|
IPC Slump A21 mm 150°C, 15 minutes 0.33 x 2.03mm pads 0.63 x 2.03mm pads |
IPC A21 Pattern 0.20 0.33 |
IPC A21 Pattern 0.20 0.33 |
|
Open Time |
24hours |
24hours |