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1、 特点 Feature
1.1先进的封装工艺，封装材料满足UL94-V0
Advanced packaging technology, packaging materials meet UL94-V0
1.2结构紧凑，体积小，节省空间
structure, small size, space saving
1.3优越的高温高湿性能
Superior high temperature and high humidity performance
1.4强大的抑制高浪涌强电流能力
Strong ability to suppress high surge and high current1.5 SMD料盘包装，适用于无铅回流焊/波峰焊自动贴装SMD tray packaging, suitable for lead-free reflow soldering/wave soldering automatic placement
1.6符合RoSH ，REACH ，H.F无卤
Comply with RoSH, REACH，H.F
